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IRS21814MPBF
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All
voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation
ratings ar e measured under board mounted and still air conditions.
Symbol
Definition Min Max Units
V B
V S
V HO
High-side floating absolute voltage
High-side floating supply offset voltage
High-side floating output voltage
-0.3
V B - 25
V S - 0.3
625
V B + 0.3
V B + 0.3
V CC
V LO
V IN
V SS
dV S /dt
P D
Rth JA
T J
T S
Low-side and logic fixed supply voltage
Low-side output voltage
Logic input voltage (HIN &LIN)
Logic ground
Allowable offset supply voltage transient
Package power dissipation @ TA ≤ 25°C
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
-0.3
-0.3
V SS -0.3
V CC - 20
—
—
—
—
-50
20 ?
V CC + 0.3
V CC + 0.3
V CC + 0.3
50
2.08
36
150
150
V
V/ns
W
°C/W
°C
T L
Lead temperature (soldering, 10 seconds) —
300
? All supplies are fully tested at 25 V and an internal 20 V clamp exists for each supply
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used
within the recommended conditions. The V S and V SS offset rating are tested with all supplies biased at 15 V
differential.
Symbol
V B
Definition Min Max Units
High-side floating supply absolute voltage V S +10 V S +20
V S
V HO
High-side floating supply offset voltage ??
High-side floating output voltage V S
600
V B
V CC
Low-side and logic fixed supply voltage 10 20
V
V LO
Low-side output voltage
0 V CC
V IN
Logic input voltage
V SS
V CC
V SS
T A
Logic ground
Ambient temperature
-5 5
-40 125 °C
?? Logic operational for V S of -5 V to +600 V. Logic state held for V S of -5 V to –V BS . (Please refer to the
Design Tip DT97-3 for more details).
www.irf.com
3
? 2008 International Rectifier
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